- Up to 12 inches
- The WBB-2000 large-area wafer-level bonder features a suspended bonding head structure that can be applied wafers of up to 12 inches.
Features
- Capable of bonding large products, contributing to improved tact time.
- Connectivity and readiness for Industry 4.0
- Real-time and all-time bonding position correction by temperature sensors.
- A time of recipe programming is 40%* shorter than previous models.
*Depends on a formation and number of bump.
Specifications
| Bonding |
Bonding accuracy |
3σ≤±3.5µm |
| Bonding area |
360mm×360mm |
| Productivity |
Bonding time |
28ms |
| Compatible wafer size |
|
Up to 12 in |
| Others |
Overall dimensions |
W1,100×D1,300×H1,840mm |
| Weight |
1,200kg |
Further specifications can be found in the brochure. (PDF file download)
