FB-e20N
- Bonding accuracy 3σ≦2.0μm
- Fully automatic thermosonic ball bonder "FB-e20N" is highly productive in a variety of packages through highly accurate recognition, new ultrasonic control, and process visualization. The transport system for this model which is suitable for the production of LED or Discrete.
Features
- Achieves bonding accuracy of 3σ ≤ 2.0 μm with a new temperature compensation system.
- Stable recognition with the new algorithm "α eyes"
- Expanded compatibility with various packages by renewed oscillation control.
- Step bond sequence that can visualize the bonding process.
- Improved traceability and self-diagnosis capability facilitates quality control and maintenance.
- SECS / GEM standard (Selectable Kaijo host management system as well)
Specifications
| Bonding | Bonding accuracy | 3σ≦2.0μm |
|---|---|---|
| Bonding area | 56mm×80mm | |
| Productivity | Bonding time | 43msec / wire |
| Indexing system | Package frame size | Width : 20 - 90mm Length : 90 - 300mm Thickness : 0.1 - 0.5mm |
| Magazine | Width : 30 - 110mm Length : 105 - 310mm Height : 100 - 175mm Stockable quantity : 2 - 3 magazines |
|
| Others | Overall dimensions | W1,065×D1,186×H1,727mm (Including indication lamp : H2,025mm) |
| Weight | 560kg |
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