FB-x26BUMP2

Up to 8" wafers applicable,
Wafer Level Bump Bonder
Wafer level bump bonder "FB-x26BUMP2" is applicable to wafers up to 8" by manual transfer as used alone.
It can also be used as a fully automatic transport by connecting to the optional transport system "WHS-996".

Features

  • Up to 8"
  • Wafers are set manually (Stand alone)
  • Enhanced traceability and self-diagnosis function
  • Automatic wafer feeding is available in combination with a WHS-996

Specifications

※スクロールで表全体をご覧いただけます。

Bonding Bonding accuracy ±3.0μm(3σ)
*Additional parts required depending on the product type
Bonding area Up to 200mm (8 “) (Manual transfer specification)

In case of automatic transfer specification, wafer circumference 2.5 mm become a non-bondable area.
  e.g. Bonding range of 8" wafer is diameter 195mm
Productivity Bonding time 30msec/bump (Pill-cut mode)
40msec/bump (Fix-cut mode)
Indexing system Wafer size Up to 8"
Transportation Semi-automatic transport (with Manual placing).
*Full automatic transport is available with WHS-996(Option)
Others Dimension FB-x26BUMP2: W930×D1,240×H1,728mm
WHS-996 : W680 x D1,190.5 x H1,424
Weight FB-x26BUMP2: 520kg
WHS-996 : 300kg
Further specifications can be found in the brochure. (PDF file download)
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