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Bonder
Ultrasonic cleaning System
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株式会社カイジョー
KAIJO CORPORATION
Bonder
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MPB-2000
MPB-2000
Go Wider! Reach Deeper!
A multi-purpose ball bonder capable of handling large-size packages and high-step devices. It has suspended bonding head structure and Z-axis vertical trajectory provide high versatility for varied packages and diverse productions.
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Features Scheduled for release in 2026
Suitable for large products Max. 300mm x 300mm
19.0mm long capillary accommodates wider applications including components up to 10mm heights
Vertical Z trajectory enables stable stitch formation at multiple heights
Supports Au and Cu wires, enabling diverse transport configurations to various devices and production
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bonder history
Products
FB-e20N
FB-i28
FB-x26
DBX-1000
FB-x26BUMP1
FB-x26BUMP2
FB-x26BUMP3
wbb-2000
FB-e20LDW
FB-e20LDW2
MPB-2000
PM-300S
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