KAIJO’s bonding machines are equipped with the cutting edge technologies in the assembly process of the semiconductor manufacturing such as high-speed and fine pitch bonding operation, high-mix low-volume production, stable performance and cost efficient in order to meet more sophisticated and diversified needs.
New model full automatic wire bonder "FB-e18" is equipped with two different frequencies ultrasonic as standard equipment, as well as last model FB-910. FB-e18 enables 5% higher productibity than last model with new camera lens for image recognition and ultra-high speed bonding timev0.043 secound per wire.
The new model “DBX-1000” is the cost effective die bonder for mounting LED chips onto a board (a lead frame). The chip mounting units which form the basis of the bonding operation became unique and compactly equipped.