Bonding Equipment

The bonding machine has latest technology to meet the diverse needs of high speed, fine pitch, high-mix low-volume production, and stability in the semiconductor assembly process.

Kaijo's wire bonders are equipped with a variety of transport structures and high-precision bonding technology to support a wide range of products achieving high productivity.
Die bonders that contribute the assembling process of mounting silicon chips on boards or lead frames combine an unique structure and compactness.

We trust that you will be satisfied with the transportation systems and bonding technologies suitable for the specifications of customer's products and packages.

If you have any questions regarding the selection of the most suitable equipment for you, please feel free to contact us.

Bonder list

Thermosonic Ball Bonder (Au, Cu, Ag)

Epoxy Die Bonder　/ Eutectic Die Bonder

Wafer Level Bonder (Stud Bump)

Ball Bonder for LASER (Rotatable Bonding stage)