Bonder

Bonding Equipment

The bonding machine has latest technology to meet the diverse needs of high speed, fine pitch, high-mix low-volume production, and stability in the semiconductor assembly process.

Kaijo's wire bonders are equipped with a variety of transport structures and high-precision bonding technology to support a wide range of products achieving high productivity.
Die bonders that contribute the assembling process of mounting silicon chips on boards or lead frames combine an unique structure and compactness.

We trust that you will be satisfied with the transportation systems and bonding technologies suitable for the specifications of customer's products and packages.

If you have any questions regarding the selection of the most suitable equipment for you, please feel free to contact us.

Bonder list

Thermosonic Ball Bonder (Au, Cu, Ag)

FB-e20N

FB-e20N

FB-i28

FB-i28

FB-996

FB-x26

Epoxy Die Bonder / Eutectic Die Bonder

DBX-1000

DBX-1000

Wafer Level Bonder (Stud Bump)

FB-x26bump1

FB-x26BUMP1

fb-x26bump2

FB-x26BUMP2

fb-996bump3

FB-x26BUMP3

Ball Bonder for LASER (Rotatable Bonding stage)

DBX-1000

FB-e18LDW

eDB-2000

FB-e18LDWⅡ

Contact InformationInquiries about products
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