FB-x26BUMP1
- Up to 6" wafers applicable,
Wafer Level Bump Bonder - Fully-automatic wafer-level bump bonder
"FB-x26BUMP1" has a transport system that automatically supplies wafers up to 6 inches stored in magazine to bonding stage.
Features
- Up to 6" wafers
- Auto-supplied wafers by Magazine
- Enhanced traceability and self-diagnosis function
Specifications
※スクロールで表全体をご覧いただけます。
| Bonding | Bonding accuracy | 3σ≦3.0μm *Additional parts required depending on the product type |
|---|---|---|
| Bonding area | 4" wafer : Diameter 95mm 6" wafer : Diameter 145ｍｍ |
|
| Productivity | Bonding time | 30msec/bump (Pill-cut mode) 40msec/bump (Fix-cut mode) |
| Indexing system | Wafer size | Up to 6" |
| Transportation | Automatic transport with Carrier | |
| Magazine size | Width:176mm Length:180mm or 200mm Height:170mm |
|
| Others | Dimension | W1,292×D1,240×H1,728mm |
| Weight | 550kg |
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