FB-x26
- Wide area bonder for large size products
- FB-x26 has expanded the bonding area in the Y direction to 95mm.
Utilizing the wide bonding area, the Bump specification version can be applied up to 8 inch wafers.
Features
- Wide bonding area : (Y) 95mm
- Maximum package width : 105mm
- High rigidity and lightweight structures realizes high precision and low impact bonding.
- Ultra-light bonding arm by composit material.
- Windows OS
Specifications
| Bonding | Bonding accuracy | 3σ≦3.0µm |
|---|---|---|
| Bonding area | 56×95mm | |
| Productivity | Bonding time | 50msec / wire |
| Indexing system | Work size | Width : 30 - 105mm Length : 90 - 300mm Thickness : 0.1 - 0.5mm |
| Magazine size | Width : 30 - 115mm Length : 100 - 305mm Height : 100 - 175mm Stockable quantity : 2 - 3 magazines |
|
| Others | Overall dimensions | W1,065 x D1,186 x H1,728mm (H2,030mm including indication lamp) |
| Weight | 550kg |
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