DBX-1000
- Fully automatic die bonder for LED products that achieves high accuracy, high productivity and comfortable operability
- The DBX-1000 is a cost-effective die bonder newly proposed by Kaijo that combines the basic chip mount function required for LED production with a unique mechanism and compactness.
Features
- High-speed, high-accuracy epoxy die bonder
- Digitizing stamping head, bonding head, and bond force.
Specifications
| Bonding system | Epoxy |
|---|---|
| Bonding speed | 0.18second / cycle (Excluding process time) |
| Bonding accuracy | Position : ±25μm(3σ) Angle : ±3°(3σ) |
| Die size | □0.15 - □1.5mm |
| Package size | Width : 20 - 100mm Length : 90 - 230mm Thickness : 0.1 - 2mm |
| Magazine size | Width : 30 - 110mm Length : 95 - 235mm Height : 100 - 175mm Stockable quantity : 2 - 3 magazines |
| Wafer size | 4 inch grip ring (Outer dia. Φ152mm) 6 inch grip ring （Outer dia. φ210mm） / OP |
| Overall dimensions | W1,750×D1,080×H2,050mm (Including indication lamp) |
| Weight | 930kg |
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