- 3D Packaging Solution
- One-by-one pillar mounting machine, equipped with auto-alignment and auto- feeder for individual pillars accommodates a wide range of devices. Contributes to pillar solutions that form a cornerstone of 3D packages.
Features
- One by one mounting method for high compatibility
- High-Speed Positioning Control Achieves XY Accuracy of ≤16 μm
- Randomly loaded Cu pillars are automatically aligned within the bonder
- Image recognition function detects pillar presence to performs repair
Specifications
| Mountin |
Method |
One by one |
| Mounting |
XY : ≤±16µm Tilt : Vertical ±2.5° |
| Takt time |
0.3 sec/pillar |
| Applicable work size |
Mounting area |
X: 44mm Y: 66mm |
| Pillar size |
Diameter : φ0.2 - φ0.5mm Length : 0.6mm - 1.0mm |
| Others |
Overall dimensions |
W1,488×D1,219×H1,825mm (H2,249mm including indication lamp) |
| Weight |
600kg |
Further specifications can be found in the brochure. (PDF file download)