FB-x26BUMP3
- Up to 8" wafers applicable,
Wafer Level Bump Bonder - Wafer level bump bonder "FB-x26BUMP3" is applicable to wafers up to 8" by manual transfer as used alone.
It can also be used as a fully automatic transport by connecting to the optional transport system "WHS-996".
Features
- 2 stage mechanism improves the productivity
- Enhanced traceability and self-diagnosis function
- Automatic wafer feeding is available in combination with a WHS-996
Specifications
※スクロールで表全体をご覧いただけます。
| Bonding | Bonding accuracy | ±3.0μm(3σ) *Additional parts required depending on the product type |
|---|---|---|
| Bonding area | Up to 200mm (8 “) (Manual transfer specification) In case of automatic transfer specification, wafer circumference 2.5 mm become a non-bondable area. e.g. Bonding range of 8" wafer is diameter 195mm |
|
| Productivity | Bonding time | 30msec/bump (Pill-cut mode) 40msec/bump (Fix-cut mode) |
| Indexing system | Wafer size | Up to 8" |
| Transportation | Semi-automatic transport (with Manual placing). *Full automatic transport is available with WHS-996(Option) |
|
| Others | Dimension | FB-x26BUMP3 : W1,132×D1,234×H1,728mm WHS-996 : W680 x D1,190.5 x H1,424 |
| Weight | FB-x26BUMP3 : 600kg WHS-996 : 300kg |
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