FB-i28
- For the products of higher specifications
- Thermosonic ball bonder FB-i28 is suitable model for memory and processors products.
The lightweight bonding head which consists of high rigidity arm and small transducer realizes high repeatability and reduced impact force contributes to your device production such as overhang structure, low&long looping and narrow pad pitch.
Features
High rigidity and lightweight structures realizes high precision and low impact bonding .
- Ultra-light bonding arm by composit material with short length transducer.
Enhanced traceability and Self-diagnosis .
Applicable to Ag alloy wire/ Cu wire / Cu bare frame bonding (option).
Ready for the growing demand of connectivity and industry4.0.
Specifications
| Bonding | Bonding accuracy | 3σ≦2.0µm |
|---|---|---|
| Bonding area | 56×88mm | |
| Productivity | Bonding time | 45msec / wire |
| Indexing system | Work size | Width : 30 - 100mm Length : 90 - 300mm Thickness : 0.1 - 0.5mm |
| Magazine size | Width : 30 - 115mm Length : 100 - 305mm Height : 100 - 175mm Stockable quantity : 2 - 3 magazines |
|
| Others | Overall dimensions | W1,065 x D1,175 x H1,725mm (H2,025mm including indication lamp) |
| Weight | 550kg |
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