Ultrasonic Welding Laboratory

Our "Ultrasonic Welding Laboratory" is a new business unit conceived with the ideal that we can and should positively impact our world with a wider use of our technology. We believe our knowledge of high-precision welding and our rich experience in the semiconductor wire bonder field, will benefit both the welding and packaging industries.

Kaijo’s wire bonder technology is used for computer chip production to connects “dots” and “lines” in a microscopic world, invisible to the naked eye. Various industrial products are now shifting toward digitalization, becoming lighter and smaller. For this reason, we believe these industries may now utilize our technology in the field of advanced manufacturing and packaging processes for electronic parts and more. To address this idea, the "Ultrasonic Welding Laboratory" was born.

Kaijo has a long history of manufacturing "plastic welding machines" and "ultrasonic welders". The technical expertise in this field has been maintained and kept in high regard.

We believe it is imperative for us to continue research in this field to meet the technically advanced needs of the future.
If you are experiencing problems with your current welding method, want to try to Kaijo’s ultrasonic welding systems or would like to know more about welding technology, please feel free to contact us.