Wire Bonding

WIRE BONDING - High Density Mounting Technology

KAIJO's main product of "Wire Bonding - High Density Mounting Technology" field is "Wire Bonder" that is semiconductor assembling and packaging equipment, into which the cutting-edge technologies have been incorporated so as to meet the various stringent demands of our customers for high-speed, fine-pitch and producing a large variety of products in a small lot, and improving productivity.
With a spread of digital hand held device, semiconductor has been developed for smaller, thinner and multi-layered, and has been expand of the usage such like for vehicle operation control.
Wire Bonder is indispensable for expanding latest semiconductor manufacturing.

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