KAIJO will be exhibiting at the 40th NEPCON JAPAN
Exhibition Information
KAIJO will be exhibiting at the 40th NEPCON JAPAN
We will be exhibiting 3 machines of semiconductor assembly that contribute to 3D packaging.
| Date | 21st Jan. ~23rd Jan. 2026 10:00 ~ 17:00 |
| Venue | Tokyo Big Sight, Japan |
| Booth | To be determined |
| Official Url | https://www.nepconjapan.jp/tokyo/en-gb.html#/ Pre-registration for visitors here |
| Products | Wefer Level Bump Bonder, WBB-2000 Wide Area Ball Bonder, MPB-2000 Cu Pillar Mounter PM-300S |
- Contact InformationInquiries about products
- Please contact us for technical inquiries and technical information from here.