KAIJO will be exhibiting at the "SEMICON JAPAN 2026"
Exhibition Information
| Date | 9(Wed) Dec. ~11 (Fri)Dec. 2026 10:00 ~17:00 |
| Venue | Tokyo Big Sight, Japan (East/West Hall) |
| KAIJO Booth | Hall E7, E7801 as "KAIJO CORPORATION" |
| Official website | https://www.semiconjapan.org/en Pre-registration for visitors is available above |
| Exhibited products | Ultrasonic Equipment Divison: [New] ‘ALLEON’ A compact ultrasonic transducer supporting frequencies from 200 kHz to 10 MHz, with a volume 40% smaller than previous models. [New] ‘Mega Pack’ Ideal for 3 MHz high-frequency operation. Through the close arrangement of transducers and direct ultrasonic irradiation, this liquid-immersion ultrasonic cleaner delivers high cleaning performance. [New] ‘High-Temperature and Chemical-Compatible Spot Shower’ This can be used with chemicals and high-temperature cleaning solutions that were previously incompatible. Bonder Machinery Division: [New] ‘WBB-2000’ A wafer-level ball bonder compatible with 12-inch wafers. It is capable of room-temperature on-sheet bonding and multi-layer bump processes. [New] ‘PM-300S’ The world’s first system featuring Cu pillars, created through a one-by-one process that contributes to the latest 3D mounting technologies. We're eager to greet you at our booth! |
- Contact InformationInquiries about products
- Please contact us for technical inquiries and technical information from here.