eDB-2000
- Eutectic die bondier for TO-Can LASER packages
- The fully automatic eutectic die bonder "eDB-2000" achieves high productivity with an efficient transfer system for TO-Can packages.
Features
- Sub-Mount and LD are bonded at the same time by the double bonding head and stage.
- Move the entire bonding stage and complete the entire process in the N2 atmosphere.
- Small footprint W1500 x D1040 x H2000
Specifications
※スクロールで表全体をご覧いただけます。
| Bonding system | Eutectic die bonding |
|---|---|
| Bonding speed | SM：1sec ,LD：2sec 4.8sec/2chip |
| Bonding Temperatuire | -400°C (Heater Block -500°C) |
| Chip size | □0.15 - □1.5mm |
| Stem type & Stem size | TO-Can (TO-33 ~ TO-9 L < 16mm) |
| Ring type & Ring size | Double ring 8 inch ring for 6 inch wefar (OD：210mm, ID：195mm) Tray |
| Tray size | W 85mm - 180mm D 85mm - 180mm H 14mm - 30mm |
| Overall dimensions | W1,500×D1,040×H2,000mm |
| Weight | 1,000kg |
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